Work package 9: Generic Photonic Integration

Work Package 9 comprises of generic photonic integration work on proof of
concept optoelectronic devices and systems. The short term driver for this technology is the provision of GaAs based integrated optoelectronic devices and systems for interconnects used in aerospace and nuclear sectors and ultimately for telecommunication networks in the long term.

Lead

Dr Nicolás Abadía (abadian@cardiff.ac.uk)

Overwiew

Generic Photonic Integration is a platform that allows the production of photonic integrated circuits ( PICs are similar to the electronic integrated circuits used in computers and other electronic devices. The main difference between the photonic integrated circuit and the electronic integrated circuit is that the former works with light and the latter works with electricity. The invention of the integrated electronic circuit was in the United States in 1958 and revolutionized electronics and our daily lives. The field progressed very quickly from very basic old computers used in big research facilities to a wide range of systems used in our daily life mobile phones, tablets, laptops, WiFi and the Internet, etc. In a similar way, PICs will revolutionize several fields including next generation telecommunication networks like the Internet or the mobile network. PICs can drastically increase the capacity and reduce the cost and power consumption of networks This will allow the streaming of 4 K content to your computer and smart TV or the development of the next generation mobile network (know as 5 G) which will allow the implementation of new services like the self driving car, telesurgery or
portable virtual reality.

Progress and Challenges

Significant progress have been made since last year when the work package was created. Some key points:
  • New collaboration with the EPSRC Future Metrology Hub including the University of Huddersfield and the University of Loughborough
  • New industrial partners including Lumerical and Seagate
  • Reinforced links with University College London with an additional project and joint PhD student
  • Reinforced links with the University of Sheffield with an additional joint PhD student
  • Several invited seminars, visits and workshops
Work package 9 has produced the following papers
  • E Le Boulbar D Hayes, H Liu, N Abadíaet al ….’Temperature Dependent Behavior of the Optical Gain and Electroabsorption Modulation Properties of an InAs /GaAs Quantum Dot Epistructure ICTON 2019
  • N Abadía et al ..,,”CMOS Compatible Multi Band TE Pass Polarizer,” Opt Express 2019
  • N Abadía et al ..’Novel Polarization Beam Splitter with High Fabrication Tolerance’ CLEO 2019

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