PBIAA fund wire bonding course at KLA

A recent wire bonding training course delivered by IMAPS-UK at KLA has been hailed a success, highlighting the strength of collaboration across industry and academia in South Wales.

The course was funded by the South Wales Compound Semiconductor Impact Accelerator (CSIA) and facilitated by the Cardiff University Professional Development Unit, bringing together expertise and resources to support workforce development in the growing compound semiconductor sector.

Participants responded very positively to the training, with many highlighting the hands-on practical sessions as a standout feature. The opportunity to work directly with equipment and learn from experienced professionals provided valuable insight that extended beyond theoretical knowledge.

Attendees also noted the benefits of having industry experts available throughout the course, enabling them to ask questions and gain deeper understanding in real time—an aspect widely regarded as crucial to enhancing the learning experience.

To find out more on  specialist short courses in semiconductor technologies with funding available through the PBIAA programme please follow the link: https://lnkd.in/e4jjZyHW